Production, Applications and Development of PEEK Catheters in the Medical Field

01

Localization of raw materials

Current status: PEEK raw materials previously relied on imports from Invibio (UK), Evonik (Germany) and Victrex (UK). Now Jilin University and Zhongyan already produce and sell in bulk, and Shandong Junhao has started construction in Shandong, with mass production expected in 2021.

02

Physical and chemical properties of PEEK

(1) A low elastic modulus close to that of bone (PEEK ~3.8 GPa, cancellous bone 3.2-7.8 GPa, cortical bone 17-20 GPa, titanium alloy TC4 ~110 GPa) prevents stress-shielding effects and helps surrounding bone maintain its original strength.

(2) X-ray transmissibility: PEEK does not show up on CT and MRI scans, making it easy to assess bone growth and healing; when visualization of the implant is needed in some cases, this can also be achieved through modification. In addition, PEEK has strong radiation resistance — with a very stable chemical structure, PEEK parts work normally even under high doses of ionizing radiation.

(3) Excellent sterilization performance: even with prolonged exposure to steam, ethylene oxide and gamma rays, its original properties remain unchanged. It can be used continuously at temperatures up to 250°C, with transient use up to 300°C.

(4) Good biocompatibility.

(5) Adjustable mechanical properties: different additives can be incorporated, including carbon fiber, barium sulfate and glass fiber, to meet specific application requirements.

(6) Greater design freedom: parts can be easily machined from semi-finished blanks or produced by injection molding; PEEK can be processed by injection molding, extrusion and 3D printing.

Current applications in orthopedic medical devices:

Sports medicine, joint fields, craniomaxillofacial surgery and interspinous devices.

Companies currently involved in this field, such as MDT, Depuy, Jiangsu Junhua and Smith & Nephew, are all engaged in R&D and production.

Injection molding and extrusion processes that meet biocompatibility requirements are a major direction.